CMP CLEANING


Post-CMP cleaning technologies – Chemical-Mechanical Planarization is a critical process for producing nearly perfect surfaces that are necessary for the most innovative and unique integrated circuits currently in production. Abrasive slurries are used in conjunction with a polishing apparatus to achieve the desired uniformity. Once polishing is complete, the residues left behind from CMP must be cleared. Aqueous cleaning solutions available from Wako Chemicals USA, INC have been shown to be highly effective Post-CMP cleaning agents.

  • Several pH variants
    • Customizable to FAB specifications
  • Corrosion protection
    • Oxidation-Reduction control
    • Galvanic
  • High degree of BTA removal
  • Suitable for Cu, Co, W, and others
  • Manufacturing in Japan (several sites) and Richmond, VA
CLEAN-100 Post CU CMP cleaning

CLEAN-100 Post CU CMP cleaning

HIGH-PURITY, HIGH PERFORMANCE ORGANIC ACID SOLUTION FOR WAFER CLEANING. PROVEN TECHNOLOGY FOR...

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CLEAN-8901 (ALKALINE TYPE) Post-CU CMP

CLEAN-8901 (ALKALINE TYPE) Post-CU CMP

HIGH CLEANING PERFORMANCE TMAH-FREE Cu2O termination No Corrosion  

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WCP-210 (neutral) Post-W CMP cleaning

WCP-210 (neutral) Post-W CMP cleaning

WCP-210 Post W-CMP Cleaning Solution Please contact sales at Wako Chemicals...

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