Post-CMP cleaning technologies – Chemical-Mechanical Planarization is a critical process for producing nearly perfect surfaces that are necessary for the most innovative and unique integrated circuits currently in production. Abrasive slurries are used in conjunction with a polishing apparatus to achieve the desired uniformity. Once polishing is complete, the residues left behind from CMP must be cleared. Aqueous cleaning solutions available from Wako Chemicals USA, INC have been shown to be highly effective Post-CMP cleaning agents.
HIGH-PURITY, HIGH PERFORMANCE ORGANIC ACID SOLUTION FOR WAFER CLEANING.
HIGH CLEANING PERFORMANCE
WCP-210 Post W-CMP Cleaning Solution Please contact sales at Wako...