HIGH-PURITY, HIGH PERFORMANCE ORGANIC ACID SOLUTION FOR WAFER CLEANING.
PROVEN TECHNOLOGY FOR VARIOUS SUBSTRATE METALS.
HIGH METAL REMOVABILITY
ONE-STEP CLEANING SOLUTION FOR IMPURITIES AND PARTICLES
Suitable for: POST-Cu-CMP CLEAN, Post-Cu/low-k CMP CLEAN
|High wettability, high metal removability and high purity citic acid soln. of different concentrations and types of additive One-step cleaning soln. for metal impurities and particles||Post Cu-CMP cleaning soln.
Post Cu/low-k CMP claening