CLEAN-100 Post CU CMP cleaning


CLEAN-100 Post CU CMP cleaning

HIGH-PURITY, HIGH PERFORMANCE ORGANIC ACID SOLUTION FOR WAFER CLEANING.

PROVEN TECHNOLOGY FOR VARIOUS SUBSTRATE METALS.

HIGH-WETTABILITY

HIGH METAL REMOVABILITY

ONE-STEP CLEANING SOLUTION FOR IMPURITIES AND PARTICLES

Suitable for: POST-Cu-CMP CLEAN, Post-Cu/low-k CMP CLEAN

 

Character Application
High wettability, high metal removability and high purity citic acid soln. of different concentrations and types of additive One-step cleaning soln. for metal impurities and particles Post Cu-CMP cleaning soln.
Post Cu/low-k CMP claening